diode,SS24F,SMAF package diode
|
Item |
Symbol | Unit | Test Conditions |
SS2 |
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|
2F |
3F |
4F |
5F |
6F | 8F |
10F |
15F |
20F | ||||
| Repetitive Peak Reverse Voltage |
VRRM |
V |
20 |
30 |
40 |
50 |
60 | 80 |
100 |
150 |
200 | |
| Maximum RMS Voltage |
VRMS |
V |
14 |
21 |
28 |
35 |
42 | 56 |
70 |
105 |
140 | |
| Average Forward Current |
IF(AV) |
A |
60HZ Half-sine wave, Resistance load, TL(Fig.1) |
2.0 |
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| Surge(Non-repetitive)Forward Current |
IFSM |
A |
60Hz Half-sine wave ,1 cycle , Ta =25℃ |
50 |
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| Junction Temperature |
TJ |
℃ |
-55~+125 |
-55~+150 |
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| Storage Temperature |
TSTG |
℃ |
-55 ~ +150 |
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Electrical Characteristics (Ta=25℃Unless otherwise specified）
|
Item |
Symbol | Unit | Test Condition |
SS2 |
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| 2F | 3F | 4F | 5F | 6F | 8F | 10F | 15F | 20F | |||||
| Peak Forward Voltage |
VF |
V |
IF =2.0A |
0.55 |
0.7 |
0.85 | 0.95 | ||||||
| Peak Reverse Current |
IRRM1 |
mA | VRM =VRRM |
Ta =25℃ |
0.5 |
0.1 |
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|
IRRM2 |
Ta =100℃ |
10 |
5.0 |
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| Thermal Resistance(Typical) |
RθJ-A |
℃/ W | Between junction and ambient |
751) |
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|
RθJ-L |
Between junction and terminal |
171) |
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Notes:
Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2″ x 0.2″ (5.0 mm x 5.0 mm) copper pad areas
Typical Characteristics
SMAF Package Outline Dimensions
SMAF Suggestesd Pad Layout
Reel Taping Specifications For Surface Mount Devices- SMAF
