diode,SK12,Schottky series diode
|
Item |
Symbol | Unit | Test Conditions |
SK |
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| 12 | 13 | 14 | 15 | 16 | 18 | 110 | 115 | 120 | ||||
| Repetitive Peak Reverse Voltage |
VRRM |
V |
20 |
30 |
40 |
50 |
60 |
80 |
100 |
150 |
200 |
|
| Maximum RMS Voltage |
V RMS |
V |
14 |
21 |
28 |
35 |
42 |
56 |
70 |
105 |
140 |
|
| Average Forward Current |
IF(AV) |
A |
60HZ Half-sine wave, Resistance load, TL(Fig.1) |
1.0 |
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| Surge(Non-repetitive)Forward Current |
IFSM |
A |
60Hz Half-sine wave ,1 cycle , Ta =25℃ |
30 |
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| Junction Temperature |
TJ |
℃ |
-55~+125 |
-55~+150 |
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| Storage Temperature |
TSTG |
℃ |
-55 ~ +150 |
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Electrical Characteristics (Ta=25℃ Unless otherwise specified）
|
Item |
Symbol | Unit | Test Condition |
SK |
|||||||||
| 12 | 13 | 14 | 15 | 16 | 18 | 110 | 115 | 120 | |||||
| Peak Forward Voltage | VF |
V |
IF=1.0A |
0.55 |
0.70 | 0.85 | 0.95 | ||||||
| Peak Reverse Current | IRRM1 | mA | VRM=VRRM | Ta =25℃ |
0.5 |
0.2 |
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| IRRM2 | Ta =100℃ |
10 |
5.0 |
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| Thermal Resistance(Typical) | RθJ-A | ℃/W | Between junction and ambient |
881) |
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| RθJ-L | Between junction and terminal |
281) |
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Notes:
Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2″ x 0.2″ (5.0 mm x 5.0 mm) copper pad areas
Typical Characteristics
SMAJ Package Outline Dimensions
SMAJ Suuggested Pad Layout
Reel Taping Specifications For Surface Mount Devices- SMA
